High-Speed Scanning Acoustic Microscopes

Scanning Acoustic Microscopes (SAM) and Acoustic Micro Imaging Equipment (AMI) for Wafer, Circuit Board, Chip, Ceramic Capacitor, LED, and Advanced Material Testing

LPR Global’s scanning acoustic microscopes (SAM) and complex acoustic micro imaging (AMI) systems perform detailed acoustic analysis in the ultrasonic range from 5MHz to 300MHz. Scanning Acoustic Microscopy is commonly used for non-destructive testing (NDT) and material properties investigation of semiconductor chips, wafer & bonded wafers, MEMS, ceramic capacitors, OLED panels, industrial plasma, copper plates, fiber optics, special materials, and complex aerospace parts.

 

Our high-speed SAM equipment significantly reduces takt time by incorporating proprietary high-frequency ultrasonic transducers, high bandwidth ultrasonic pulser-receivers, and high-speed image processing software. Our SAM equipment allows real-time ultrasonic 2D and 3D image output and instant defect measurement report generation based on the defect location (XYZ coordinates), sample size, and type.

 

We offer both standard and custom equipment, as well as contract SAM inspection and testing services.

Please contact us for more information or connect with a product specialist at [email protected].

Scanning Acoustic Microscopy SAM, Acoustic Micro Imaging (AMI) Equipment Overview

Scanning Acoustic Microscopy (SAM) enables the visualization of the internal structure of materials. This non-destructive testing method uses ultrasonic acoustic waves to image the interior of optically opaque (non-transparent) materials without causing any damage to the inspected sample. Scanning Acoustic Microscopes are commonly used to detect defects, voids, cracks, and delaminations in multilayered structures.

 

SAM is a versatile inspection method that can be used for a range of materials including metals, composites, ceramics, polymers, and biological tissues. Scanning Acoustic Microscopy is therefore used in numerous industries including electronics and microelectronics, aerospace, advanced materials, and life sciences.

 

The Fast-Scanning Acoustic Microscope (FSAM) and Traditional Scanning Acoustic Microscope (TSAM) models include user-friendly interfaces, precise focusing features, and more data gates to easily check for cracks, inclusions, voids, and density variations in semiconductor wafers and advanced components at a wide range of transducer frequencies, from 5MHz to 300MHz. A-scans, B-scans, C-scans, and Through-scan SAM analyses are available.

 

Scanning Acoustic Microscope (SAM) Equipment Advantages

LPR Global’s Scanning Acoustic Microscopes (SAM) reduce takt time by up to 20 times by incorporating high-speed scanning modules and improved equipment design. Scanner modules are equipped with multiple ultrasonic sensors for a shorter takt time, higher throughput, and precise scans.

Scanning Acoustic Microscope Main Features  

  • Ultra-fast linear equipment with high acceleration results in high throughput and precise scans
  • Resolution up to 5 μm
  • Provide selectable frequency ranges between 5MHz and 300MHz
  • 4CH multi-channel and high bandwidth Pulser Receiver
  • Multiple transducer design and enhanced scan capabilities
  • Wide scanning range

 

Applications of Scanning Acoustic Microscopes

Scanning Acoustic Microscopes are commonly used for microelectronic and semiconductor components (circuit boards, chips, capacitors, wafers, LEDs, transistor chips, optoelectronics), NDT testing of failure analysis, product reliability testing, quality control, process development, counterfeit detection, and process validation. Main applications include the semiconductor, microelectronic, life science, automotive aerospace, nanotechnology, and advanced materials industries.

 

With the ability to detect thin air gaps and anomalies, the TSAM and FSAM models of Scanning Acoustic Microscopes can penetrate dense metallic materials in failure analysis, void detection, delamination inspection, crack detection, PCB anomalies of semiconductor components inspection, and inspection of switches, sensors, power devices, and raw materials.

 

Acoustic micro imaging systems are used in laboratories and at the corporate level for low-volume production and R&D inspection; custom-designed automated systems for larger-scale inspections are also available.

Scanning Acoustic Microscopy Software

Our Scanning Acoustic Microscope offerings include a computer unit to control the type of scanning performed, adjust scanning parameters such as scanning frequency, and record scan results. LPR Global’s SAM software is highly customizable with various options to meet your SAM application needs. The basic capabilities of our TSAM and FSAM models include the following:

 

  • High-speed Image Processing
  • Real-time A, B, C and X-scanning Capabilities
  • Real-time indication of Amplitude and Time of Flight during Scanning
  • Option of Gray Scale or Color Imaging of Scans
  • Instant Generation of Defect Measurement Reports which include Defect Location and Size

 

In addition to the basic functions, LPR Global offers a wide range of optional software capabilities that can be included based on the scanning application. Some of the additional software functionalities that we provide include:

 

  • 3D Surface Rendering
  • T-Scanning Capability
  • Image Filtering

Scanning Acoustic Microscopy Models & Specifications

We offer basic, advanced, and production (for automated solutions) models. Standard and custom built options are available.

SAM Scanning Acoustic Microscopy Models

SAM Scanning Acoustic Microscopy Models and Specifications

Traditional Scanning Acoustic Microscopy | TSAM-400

1-4CH | 5-200MHz

Traditional Scanning Acoustic Microscope
Traditional Scanning Acoustic Microscope
SAM TSAM 400 Wafer Materials
SAM Scanning Acoustic Microscopy TSAM-400

Fast Scanning Acoustic Microscopy | FSAM-400

4CH & 300MHz Multi-Channel High Bandwidth Pulser Receiver

 

Average scanning speed of FSAM and W-FSAM models is 125 seconds.

Fast Scanning Acoustic Microscope FSAM
Fast Scanning Acoustic Microscope FSAM
FSAM 400 High Speed Inspection SAM
FSAM Fast Scanning Acoustic Microscopy FSAM-400

Wafer Defect Inspection Fast Scanning Acoustic Microscopy | W-FSAM-400

1-4CH | 5-200MHz Multi-Channel High Bandwidth Pulser Receiver

 

Takt time is reduced from 90 minutes to 9 minutes while scanning standard 12 inch wafer samples.

 

Used for inspections of epi-wafers, polished wafers, diffusion wafers, annealed wafers, SOI wafers, and compound wafers.

 

This system delivers a 5 µm sensitivity and a throughput significantly faster than competitive systems. W-FSAM models can be used for thermoelectric wafer and silicon wafer inspections.

Wafer Fast Scanning Acoustic Microscope FSAM
Wafer Fast Scanning Acoustic Microscope FSAM
Wafer Inspection Fast Scanning Acoustic Microscopy
Wafer FSAM Fast Scanning Acoustic Microscopy Wafer FSAM

Scanning Acoustic Microscopy | Table-type SAM

1-4CH | 5-200MHz Compact Table-type SAM

Table SAM Acoustic Microscope
Table SAM Acoustic Microscope
SAM Scanning Acoustic Microscopy Specifications Table

Scanning Acoustic Imagining Inspection Project Experience

Semiconductor | 12 Inch Wafer Sample Acoustic Microscopy

 

Wafer Fast Scanning Acoustic Microscope (W-FSAM) is designed for semiconductor and wafer inspection, of cavities, cracks, voids, bubbles, inclusions, and delamination. Our Wafer Fast Scanning Acoustic Microscopes are highly sensitive to material defects and can detect delamination of sub-micron thickness.   

SAM Inspection Wafer Sample
SAM Inspection Wafer Sample
SAM Inspection Wafer Aplitude Imaging
SAM Inspection Wafer Aplitude Imaging
Wafer Chip Fast Scanning Acoustic Microscope Inspection
Wafer Chip Fast Scanning Acoustic Microscope Inspection

Advanced Materials | Aerospace, Automotive, Microelectronics, Industrial

TSAM-400 model is designed to meet the demand from the aerospace, automotive, medical, industrial and military industries to inspect microelectronics, advanced and complex composite materials and assemblies.  

 

Due to the combination of high-throughout speed and high-frequency and transducer technology, out TSAM-400 models enable detailed acoustic analysis in the ultrasound range up to 200MHz, particularly suitable for cost-efficient and non-destructive investigation of the advanced materials and components. This model uses a wide range of transducer frequencies, providing the flexibility to analyze various materials and part types.

 

Scanning Acoustic Microscopy TSAM-400 model allows to obtain information from different layers in materials and is commonly used to calculate thickness of internal layers, features’ depth, and anomalies within the samples.

SAM Spot Welding Sample Inspection
SAM Spot Welding Sample Inspection
Carbon Fiber Reinforced Polymer SAM Inspection
CFRP Sample, Aerospace
SAM Inspection CPU, copper plate
SAM Inspection Copper Plate & Microelectronic Laptop CPU Chips
SAM Inspection CFRP Aerospace
Carbon Fiber Reinforced Polymer Sample Inspection

Scanning Acoustic Microscopy Testing Process for Semiconductor and Advanced Materials Components

Manufacturer and Client Portfolio

Developed in partnership with a S. Korean Pukyoung National University’s R&D laboratory, we supply advanced high-speed Scanning Acoustic Microscopes for material acoustic imaging.

 

Our ultrasonic microscopes are used by LG Display, Samsung Electronics, and POSCO for internal defects of OLED panel inspections, microelectronic part structural defect inspections, automotive car structural defects, and materials analysis.

Scanning Acoustic Microscopy Contract Inspection Services

We supply SAM and ultra-high resolution SAM equipment, as well as provide contract testing analysis, feasibility studies, and sample assessment assistance at our lab in S. Korea.

 

Testing is performed at an ISO/IEC 17025:2005 certified testing facility. We also offer complimentary feasibility analysis.

SAM Inspection services

Sample Requirements | SAM Contract Testing

  • Required testing lead time: 10~15 working days
  • sample dimensions: 300 L x300 W x100 H (mm) // 12″L x 12″W x 4″”H
  • Materials: semiconductors, wafers, electrical boards or parts, display panels, ceramic capacitors, composite material, and metal boards
  • Shape: flat and plate type. Irregular shapes and multi-layered materials might affect testing resolution. Needs to be discussed.
  • defect size: 50um
  • Report: standard or custom per client’s request

 

We provide acoustic microscopy services on TSAM-400 and W-FSAM series of acoustic instruments with a possibility to adjust transducer signal for product specific inspections.

SAM Scanning Acoustic Microscope Software Display
SAM Scanning Acoustic Microscope Software Display

Scanning Acoustic Microscope Clientele

  • LG Display
  • Samsung
  • Samsung Electronics
  • POSCO
  • SK Hynix
  • Hyundai
  • KCC E&C

 

Scanning Acoustic Microscope (SAM) Project Experience:

  • 2017. Detected internal defects of OLED pane for LG Display 
  • 2017. Detected internal defects of CPU sample for Samsung SDI 
  • 2018. Detected internal defects of CPU sample for Samsung Electronics 
  • 2018. Detected internal defects of copper plate for KCC 
  • 2019. Detected internal defects of battery for Samsung SDI 
  • 2020. Detected internal defects of frame of car sample for Hyundai 
  • 2020. Detected internal defects of copper plat for KCC 
  • 2020. Detected internal defects of HIC sample for POSCO Research 
  • 2020. Detected internal defects of blister plate 
  • 2020. Detected internal defects of semiconductor wafer for Samsung Electronics 
  • 2021. Detected internal defects of power semiconductor for Hynix 

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