High-Speed Scanning Acoustic Microscopes

Scanning Acoustic Microscopy SAM, Acoustic Micro Imaging (AMI) Equipment Overview

LPR Global’s scanning acoustic microscopes are used to conduct acoustic microscopy and acoustic micro imaging inspections of multi-layered electronic, microelectronic, aerospace, advanced materials, and life science components. 

The Fast Scanning Acoustic Microscopes (FSAM) and Traditional Scanning Acoustic Microscopes (TSAM) models include user-friendly interface, precise focusing features, and more data gates to easily check for cracks, inclusions, voids, and density variations in semiconductor wafers and advanced components at a wide range of transducer frequencies from 5MHz to 300MHz. A-scans, B-scans, C-scans, and through SAM analysis are available. 

Scanning Acoustic Microscope (SAM) Equipment Advantages

LPR Global’s Scanning Acoustic Microscopes (SAM) reduce takt time by up to 20 times by incorporating high-speed scanning modules and improved equipment design. Scanner modules are equipped with four ultrasonic sensors for a shorter takt time, high throughput, and precise scans. 

Scanning Acoustic Microscope Main Features  

• Ultra-fast linear equipment with high acceleration results for high throughput and precise scans
• Resolution up to 5 μm
• Provide selectable frequency ranges between 5MHz and 300MHz
• 4CH multi-channel and high bandwidth Pulser Receiver
• Multiple transducer design and enhanced scan capabilities
• Wide scanning range
• Fully automated in-line inspection solutions

Applications of Scanning Acoustic Microscopes

Scanning Acoustic Microscopes are commonly used for microelectronic and semiconductor component (circuit boards, chips, capacitors, wafers, LEDs, transistor chips, optoelectronics) NDT testing of failure analysis, product reliability testing, quality control, process development, R&D, counterfeit detection, and process validation. Main applications include semiconductor, microelectronics, life science, automotive aerospace, nanotechnology, and advanced materials.

With the ability to detect thin air gaps and anomalies, TSAM and FSAM models of Scanning Acoustic Microscopes are able to penetrate dense metallic materials in failure analysis, void detection, delamination inspection, crack detection, PCB anomalies of semiconductor components inspection; switches, sensors, power devices, and raw material SAM inspections. 

Acoustic micro imaging systems are used at laboratories and at corporate level for low-volume production and R&D inspection; custom designed automated systems for larger scale inspection are also available.

Scanning Acoustic Microscopy Models & Specifications

We offer basic, advanced, and production (for automated solutions) models. Standard and custom built options are available.

Fast Scanning Acoustic Microscopy | FSAM-400

4CH & 300MHz Multi-Channel High Bandwidth Pulser Receiver

Average scanning speed of FSAM and W-FSAM models is 125 seconds.

Wafer Defect Inspection Fast Scanning Acoustic Microscopy | W-FSAM-400

1-4CH | 5-200MHz Multi-Channel High Bandwidth Pulser Receiver

Takt time is reduced from 90 minutes to 9 minutes while scanning standard 12 inch wafer samples.

Used for inspections of epi-wafers, polished wafers, diffusion wafers, annealed wafers, SOI wafers, and compound wafers.

This system delivers a 5 µm sensitivity and a throughput significantly faster than competitive systems. W-FSAM models can be used for thermoelectric wafer and silicon wafer inspections.

Scanning Acoustic Microscopy | Table-type SAM

1-4CH | 5-200MHz Compact Table-type SAM

Advanced Materials | Aerospace, Automotive, Microelectronics, Industrial

TSAM-400 model is designed to meet the demand from the aerospace, automotive, medical, industrial and military industries to inspect microelectronics, advanced and complex composite materials and assemblies.  

Due to the combination of high-throughout speed and high-frequency and transducer technology, out TSAM-400 models enable detailed acoustic analysis in the ultrasound range up to 200MHz, particularly suitable for cost-efficient and non-destructive investigation of the advanced materials and components. This model uses a wide range of transducer frequencies, providing the flexibility to analyze various materials and part types.

Scanning Acoustic Microscopy TSAM-400 model allows to obtain information from different layers in materials and is commonly used to calculate thickness of internal layers, features’ depth, and anomalies within the samples.

Scanning Acoustic Microscopy Testing Process for Semiconductor and Advanced Materials Components

Manufacturer and Client Portfolio

Developed in partnership with a S. Korean Pukyoung National University’s R&D laboratory, we supply advanced high-speed Scanning Acoustic Microscopes for material acoustic imaging.

Our ultrasonic microscopes are used by LG Display, Samsung Electronics, and POSCO for internal defects of OLED panel inspections, microelectronic part structural defect inspections, automotive car structural defects, and materials analysis.