PLC Rotary Table Surface Grinders for Silicon, Quartz and Silicon Carbide
Horizontal and Vertical Spindle Rotary Table Surface Grinder with < 3㎛ Flatness and Parallelism for Quartz, Ceramic and SiC
As a recognized grinding machine provider to companies in the semiconductor industry and high-precision fabrication business, we manufacture PLC controlled rotary table surface grinders in both horizontal and vertical spindle type. Our grinders are built on iron beds for absolute rigidity and sturdiness against vibration. They are equipped with spindles imbedded with hydrostatic metal bearing, and a box way slide system that utilizes scraping techniques for superior precision and service life.
With a flatness and parallelism tolerance of <3㎛, our rotary table grinders are designed to meet surface roughness requirement for clients in semiconductor, battery and high precision machine manufacturing industries. Since 2006, we have been supplying horizontal and vertical spindle rotary table surface grinders to global leaders of semiconductor technology.
Scraping Techniques, Hydrostatic Metal Bearing Spindle, and Rigid Box Way for Precise Flatness and Parallelism of Horizontal Spindle Rotary Table Surface Grinders
By applying scraping techniques to the rotary table slide and the box way of the rotary table grinders we achieve a rigidity of near 0 mm, as well as flatness and parallelism against vibration. Our excellent scraping techniques are the results of decades of craftmanship and experience as a leading manufacturer of rotary table grinding machines with horizonal or vertical axis spindles.
All our grinders have automatic lubrication and wheel dressing systems, automatic balancer for the spindle, and an HMI touch-screen control panel.
PLC Rotary Table Surface Grinders with Horizonal Spindle
Our horizontal spindle rotary table surface grinders are available in both ram type and column type. Most of our clients use our column type horizonal spindle rotary table surface grinders, which can operate up to 450mm in height with a table diameter from 800 mm to 3,000 mm. The ram type grinders can operate up to 120mm in height with a table diameter range from 400 mm to 600 mm. Both types of grinders have a tolerance of <3㎛ for flatness and alignment of spindle shaft, table surface and table plane.
All our horizontal spindle grinders have hydrostatic metal bearings in the spindle structure to ensure durability of bearing life against heat deformity and vibration. As a result, our horizontal grinders are an excellent choice for either rough grinding, which generates a lot of heat and vibration, or highly precise surface grinding, which demands absolute flatness and parallelism.
Technical Data of Rotating Table Surface Grinding Machine with Horizontal Spindle
Scraping Applied to Rotary Table Slide and Box Ways for Table Surface Rigidity
Most other rotary table surface grinder manufacturers use conventional thrust roller bearings for their rotary table slide. Thrust roller bearings deliver inferior precision, as well as shorter service life due to their low resistance against wear and tear from prolonged use. As a result, grinders that use thrust roller bearings also require frequent repairs and replacements of the bearings.
As a superior alternative, our table slides use metal rings that are processed with our scraping techniques and fabricated with grooves for the lubricant oil. This technique delivers table surface rigidity against vibration to nearly 0 mm with sustained performance for an extended period, which reduces the need for regular maintenance.
Scraping technique is also applied to our box way of x-axis transfer slide to achieve superior parallelism and flatness of table surface. This differs from the LM-guide way for the x-axis that is widely used by other manufacturers. LM-guide ways have a transfer precision of roughly 0.005mm to 0.01mm on the grinder’s wheels and table and are unable to deliver high precision level. Moreover, the LM-guide requires frequent maintenance to adjust for the LM-guide’s loosened balls. By using our scraping techniques, LPR Global’s box way overcomes these shortcoming to deliver a <3㎛transfer precision of table and wheel and maintain high precision levels for an extended service life.
Horizontal and Vertical Spindle Rotary Table Surface Grinder Video
Grinder Spindle Shaft Video
CNC Vertical Spindle Rotary Table Surface Grinders
Our vertical spindle rotary table surface grinders are favoured by clients over competing brands for applications in grinding semiconductor materials such as quartz, ceramic, silicon and SiC.
Unlike metal surfaces, which can be ground by stone, these semiconductor materials require diamond-coated wheels for grinding. A common issue of vertical spindle rotary grinders is a transfer error (< 5 micron) in the z-axis occurs after a year of use. Z-axis errors are a critical problem for the semiconductor industry because such errors can cause damage or destruction of semiconductor components during grinding with the diamond wheel.
Our vertical spindle grinders are designed to prevent z-axis errors by addressing the cause of the error. First, our machines have a balance weight on the ball screw, and they use a combination of flat slide and LM-guide for box way. Second, they also have a z-axis slide installed outside of the main cover of grinding chamber. As a result, our vertical spindle grinders sustain the same tolerance rate over extended periods, and they can automatically adjust grinding amount on the scale of 1 micron.